EBD8-600A

• 
  Chip
• 
  Cantilever
• 
  Tip

Part number NT_EBD8-600_v0010

TIP
Material	HDC/DLC	-
Shape	conical	-
Tip length / I	8000 nm	(6000-8000 nm)
Diameter / d(measured at 1000 nm)	100 nm	(80-120 nm)
Diameter / d(measured at 5000 nm)	600 nm	(580-620 nm)
Half cone angle / Φ	< 3°	(AR>10)
Radius/r	< 5 nm	(<10 nm)
Tilt compensation / Θ	13°	(±1°)
Pyramid height / PH	21 ㎛	(18-23 ㎛)
Tip set back/TSB	15 ㎛	(5-25 ㎛)

Cantilever
Material	Si	-
Shape	NT-RTESPA	-
Length /L	120 ㎛	(±5 ㎛)
Width/W	30 ㎛	(±2 ㎛)
Thickness/T	4.4 ㎛	(±0.5 ㎛)
Force constant/k	40 Nm	(±20 N/m)
Resonance Frequency /f	&320 kHz	(50 kHz)

Coating
Tip side	none	-
Back side	reflex	-

Chip
Length / L_Chip	3400 ㎛	-
Width/W_Chip	1600 ㎛	-
Thickness /T_Chip	315 ㎛	-
Alignment grooves	no	-

n/a: specification not applicable for this product
Numbers in parentheses: guaranteed range

• Spike Small and Sharp: MSS
• Metrology SuperSharp carbon AFM tips for the inspection of very fine high aspect ratio features
• Down to <8 nm tip width at 50 nm depth
• Tip apex radius of <2 nm for ultrahigh resolution AFM imaging on HAR features
• For automated non-contact imaging at 75 kHz or 320 kHz

HDC-40

• 
  Chip
• 
  Cantilever
• 
  Tip

Part number NT_EBD8-600_v0010

TIP
Material	HDC/DLC	-
Shape	conical	-
Tip length / I	400 nm	(±100 nm)
Diameter / d(measured at 100 nm)	20 nm	(±2 nm)
Diameter / d(measured at 3000 nm)	40 nm	±100 nm)
Half cone angle / Φ	< 4°	(AR>8)
Radius/r	2-3 nm	(<5 nm)
Tilt compensation / Θ	3°	(±0.5°)
Pyramid height / PH	15 ㎛	(10-15 ㎛)
Tip set back/TSB	15 ㎛	(5-25 ㎛)

Cantilever
Material	Si	-
Shape	NT-RTESPA	-
Length /L	120 ㎛	(±5 ㎛)
Width/W	30 ㎛	(±2 ㎛)
Thickness/T	4.4 ㎛	(±0.5 ㎛)
Force constant/k	40 Nm	(±20 N/m)
Resonance Frequency /f	320 kHz	(50 kHz)

Coating
Tip side	none	-
Back side	reflex	-

Chip
Length / L_Chip	3400 ㎛	-
Width/W_Chip	1600 ㎛	-
Thickness /T_Chip	315 ㎛	-
Alignment grooves	no	-